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Problems in the use of electroplating equipment often (1)


In the process of using electroplating equipment often there will be some of this or that problem, is the electromechanical plating here summed up a few more common fault, hope to help customers!

1, pitting. Pitting is due to dirty parts. The bath is dirty. Features are convex, no light phenomenon, no fixed shape.

2, pinhole. Pinholes are due to the adsorption of hydrogen on the surface of the plating, the delay does not release. When the bath in the absence of wetting agent and the current density is high, easy to form pinholes.

3, air stripe. Air stripe one is due to excessive additives, the second is the cathode current density is too high, the third is too high complex agent. If the bath flow is slow, the cathode moves slowly, the hydrogen close to the surface of the workpiece during the process of the impact of the crystallization of the crystallization of the formation of a strip of air from the bottom line.

4, the coating brittle. Most of the causes of brittleness are additives, brighteners, or inorganic salts. Too much organic impurities. When the nickel layer and the substrate between the crack, it is determined that the nickel layer brittle. When the tin layer and the nickel layer between the crack, it is determined that the tin layer brittle.

5, cover plating. The cover is due to the fact that the soft flakage of the surface of the workpiece is not removed and the electrodeposited deposition can not be carried out here.

6, air bag. The formation of the air bag is due to the shape of the workpiece and the formation of gas conditions. In the plating, as long as the attention of the workpiece hook can avoid the phenomenon of air bag.

7, plastic plastic black central "tin flower". There are tin plating on the blackbody, this is because the tube in the wire, the gold up the parabolic is too high, plastic gold exposed on the surface of the black body, tin plated on the gold, like a flower.

8, "climb tin". This is due to pre-plating treatment, brushing the SMD frame with copper brush, and wear down the copper powder embedded in the black body is not easy to wash away, become conductive "bridge", as long as the electroplating metal to catch the "bridge" to extend, branches Like sedimentary climb to open with other copper powder, climb tin area is growing.

9, "to be tin". This is because the SMD frame in the use of silver plating plating, the cover device is not tight, silver plating where there is no silver plating. In the plastic, some silver layer exposed in the black body outside. And in the pre-plating treatment when the silver layer pry, tin plated on the tin is like the same or piles of tin. Overcoming the silver layer is one of the keys to silver plating technology.

10, orange peel-like coating. When the substrate is very rough, or before the process of corrosion occurred in the process or Ni42Fe + Cu substrate in the pre-plating treatment, some copper layer has been removed, and some areas of copper layer has not been withdrawn, the entire surface of the hair Flowers are not smooth.

11, pocket coating. The surface of the coating has a dense irregular pockets (and pinholes are different) was "smallpox face" coating. (1) When the jet pressure is too high, the kinetic energy of the glass beads to the surface of the impact of the impact of a small pit. When the coating is thin, there is no filling pits, it becomes a "ceiling face" coating.

(2) the matrix material alloy metallographic uneven, in the pre-plating process of selective corrosion phenomenon. After the plating did not fill the pockets, but also "smallpox face" coating.

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